中国加快先进芯片开发

China Speeds Up Advanced Chip Development

在与西方之间持续的贸易紧张关系中，中国正在加速发展其国内半导体产业，以期变得更加自给自足。China is accelerating its efforts to advance its domestic semiconductor industry, amid ongoing trade tensions with the West, in hopes of becoming more self-sufficient.

中国在IC技术方面仍然落后，并且距离自力更生还很遥远，但它正在取得显着进步。直到最近，中国的国内芯片制造商仍受制于成熟的代工工艺，并且没有内存。不过，最近，一家中国代工厂进入了14nm fin FET市场，研发能力为7nm。中国也正扩展到内存，在晶圆厂设备领域，中国正在开发自己的（EUV）光刻系统，该技术可对芯片中最先进的特征进行图案化。The country is still behind in IC technology and is nowhere close to being self-reliant, but it is making noticeable progress. Until recently, China’s domestic chipmakers were stuck with mature foundry processes with no presence in memory. Recently, though, a China-based foundry entered the 14nm fin FET market, with 7nm in R&D. China also is expanding into memory. And in the fab equipment sector, China is developing its own EUV lithography system, which is a technology that patterns the most advanced features in chips.

中国不太可能在短期内发展自己的EUV系统。就此而言，至少目前中国的铸造和存储工作还很薄弱，而且中国不会很快超过跨国芯片制造商。It’s unlikely that China will develop its own EUV system in the near term. And for that matter, the nation’s foundry and memory efforts are modest, at least for now. And China won’t overtake multinational chipmakers anytime soon.

尽管如此，出于多种原因中国正在发展其国内IC产业。一方面，中国从外国供应商那里进口了大部分芯片，这造成了巨大的贸易缺口。中国拥有庞大的集成电路产业，但规模还不足以弥合差距。作为回应，中国正在向集成电路产业投入数十亿美元，并计划制造更多自己的芯片。简而言之，它希望减少对外国供应商的依赖。Nonetheless, it is developing its domestic IC industry for several reasons. For one thing, China imports most of its chips from foreign suppliers, creating an enormous trade gap. China has a sizeable IC industry, but it isn’t large enough to close the gap. In response, the nation is pouring billions of dollars into its IC sector with plans to manufacture more of its own chips. Simply put, it wants to become less dependent on foreign suppliers.

中国最近加快了这些努力，特别是在美国与中国发动多方贸易战时。仅举一个例子，美国使华为更难获得美国芯片和软件。最近，美国阻止了ASML将EUV扫描仪运送给中国最大的晶圆代工厂商SMIC。中国将这些行动和其他行动视为阻碍其发展的一种方式，促使其加快自身技术的发展。China recently accelerated those efforts, especially when the U.S. launched a multi-prong trade war with the nation. In just one example, the U.S. has made it more difficult for Huawei to obtain U.S. chips and software. And recently, the U.S. blocked ASML from shipping an EUV scanner to SMIC, China’s largest foundry vendor. China sees these and other actions as a way to hamper its growth, prompting it to speed up the development of its own technologies.

苹果5大Arm芯Mac或亮相WWDC20，完全过渡自研芯片需一年半

智东西（公众号：zhidxcom）编 | 信仪 导语：传闻称苹果首次使用Arm架构的Mac机型将宣布，包括13英寸的MacBook Pro和具有全新外形的iMac。 智东西6月22日消息，在苹果WWDC 2020开发者大会开始还有几个小时的时候，又有关于其自研Mac电脑芯片和产品的更多爆料

同时，美国表示其与贸易有关的行为是有道理的，声称中国从事不公平的贸易做法，未能保护美国的知识产权。中国驳回了这些主张。尽管如此，该行业需要密切关注贸易问题以及中国在半导体领域的进步。它们包括：Meanwhile, the U.S. says its trade-related actions are justified, claiming that China is engaged in unfair trade practices and has failed to protect U.S. intellectual-property. China dismisses those claims. Nonetheless, the industry needs to keep an eye on the trade issues as well as China’s progress in semiconductors. They include:

o 中芯国际正在交付14nm fin FET，并在研发中采用类似7nm的工艺。SMIC is shipping 14nm fin FETs, with a 7nm-like process in R&D.

o 长江存储技术有限公司（YMTC）最近凭借64层设备进入了3D NAND市场。 128层技术正在研发中。Yangtze Memory Technologies (YMTC) recently entered the 3D NAND market with a 64-layer device. A 128-layer technology is in R&D.

o 长鑫存储技术有限公司（CXMT）正在交付其第一款产品，即19nm DRAM产品线。ChangXin Memory Technology (CXMT) is shipping its first product, a 19nm DRAM line.

o 中国正在向包括氮化镓（GaN）和碳化硅（SiC）的复合半导体领域扩展。China is expanding into compound semis, including gallium nitride (GaN) and silicon carbide (SiC).

o 中国的OSAT正在开发更高级的软件包。China’s OSATs are developing more advanced packages.